A picture of Chemopad F-NC polishing pad

Chemopad F/NC

The Chemopads F/NC polishing pad is manufactured from a buffed polyurethane with microscopic voids, laminated onto a nonwoven substrate. The open-porous structure provides the possibility of using the Chemopad F/NC for semiconductor final wafer polishing under high, average, and low pressure, which reduces the need for pad change and increases productivity.


  • Buffed polyurethane foam


  • Thickness: 1.50 mm
  • Hardness as is: 63° Shore A
  • Density: 0.38 g/cm³
  • Compressibility: 10%

Available with PSA adhesives EB and HS or OviO magnetic backing.

Product information

Shelf life: 24 months from production date.

Packaging: Our polishing pads are packaged in sealed bags of 10 to ensure that they remain clean during transportation. The bags are packaged in boxes to ensure that the pads remain laying flat in order to prevent creasing of the backing or delamination of the liner before usage.

Backings: Our polishing pads are available with PSA adhesives HS and EB or OviO magnetic backing. For more information about our backings see next tab.


  • Aluminum Oxide
  • Silicon carbide
  • Sintered carbides
  • Aluminum Nitride
  • Cobalt chrome
  • Zinc oxide
  • Quarts
  • Lithium tantalate
  • Lithium niobate
  • Acrylics
  • Polycarbonate
  • Epoxy
  • Silicon
  • Silicon Oxide
  • Silicon carbide
  • Germanium
  • Gallium nitride
  • Gallium arsenide
  • Indium phosphide
  • Neodymium gallate
  • Zinc telluride
  • Zinc selenide
  • Sapphire
  • Quartz
  • BK7
  • Fused silica
  • Glass (soda-lime)
  • Glass ceramics
  • Gorilla
  • Borofloat
  • Borosilicate
  • Zerodur
  • Aluminosilicate
  • Zinc sulfide
  • Optical components
  • Crystals
  • Steel
  • Stainless steel
  • Titanium
  • Aluminum
  • Precious metals
  • Cast iron
  • Copper/brass
  • Minerals
  • Fiber optics
  • Electronics/PCB
  • Thermal spray coatings
  • Composites (CFK/GFK)


Our HS adhesive has a special polymer-based adhesive at on the laminating side and an acrylic adhesive on mounting side with a polyester-liner.
The HS provides excellent adhesion to the polishing cloth and excellent dimensional stability. A very strong adhesion to the plate during application, but still easy to remove at the end of the polishing process. A thicker carrier ensures easier mounting of thin cloths.
NGL Polishing Technologies have developed HS as a unique adhesive designed to be used with most known slurries in the polishing process. It is resistant towards water, water-glycol mixtures, alcohol, alcohol-glycol mixtures, oil (petroleum distillates), oil in water emulsions, bleach, etc.


Our EB adhesive comes with a rubber-based high tack and peel adhesive at the laminating side, removable acrylic adhesive on mounting side and a siliconized paper-liner. The benefits of the EB adhesive are perfect adhesion with the polishing cloth and very good adhesion to the plate during application.
EB is a strong adhesive designed for mounting on all polishing cloths requiring an excellent lamination. Furthermore, it is resistant to alcohol and water-based slurries.


The flexible foil, together with a magnetic plate, eases the removal and alignment of the pad, and reduces down-time significantly. It makes it possible to re-use your polishing cloths until it is worn out, and is without the sharp edges usually found on hard metal-backings.

Applications Intended for use as backing for all our polishing-cloths.

Need more information?

Request technical data sheet

Appears in