Wafers made from various substrates are formed using different growing processes and are then sliced using a wire saw or blade saw. After this step, they are then lapped to improve flatness, chemically etched to remove crystal damage from machining and finally polished to form wafers. NGL Polishing Technologies have more than 75 years of polishing expertise and is proud to be a trusted partner in the Semiconductor and Electronics industry. We provide a wide range of polishing supplies for your lapping and polishing needs to ensure extreme purity and excellent surface finish.
